Application System
Laser Processing
Processing Software

It is a software that can set processing pattern and area on the screen while observing the position of processing by camera.
It integrates the set of wavelength switching and irradiation condition of multiple laser, switching of the objective lens, and control of the stage.
It corresponds to drawing CAD data like DXF and to mass production line from prototype applications.

Removing metal thin film of 10μm or less

Cutting silicon wafer of about 100μm thickness

Cutting metal and ceramic of 100 - 500μm thickness, drilling (φ100μm - )